Solid state intermetallic compound layer growth between Sn-8Zn-3Bi solder and bare copper substrate

✍ Scribed by Dae-Gon Kim; Hyung-Sun Jang; Seung-Boo Jung

• Publisher: Springer US
• Year: 2005
• Tongue: English
• Weight: 857 KB
• Volume: 16
• Category: Article
• ISSN: 0957-4522
• DOI: 10.1007/s10854-005-2727-0