Solid state intermetallic compound growth between copper and high temperature, tin-rich solders—part I: Experimental analysis

✍ Scribed by P. T. Vianco; K. L. Erickson; P. L. Hopkins

• Book ID: 112811921
• Publisher: Springer US
• Year: 1994
• Tongue: English
• Weight: 924 KB
• Volume: 23
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/bf02651365