✦ LIBER ✦

Solderability of Sn–9Zn–0.5Ag–1In lead-free solder on Cu substrate: Part 1. Thermal properties, microstructure, corrosion and oxidation resistance

✍ Scribed by Tao-Chih Chang; Jian-Wen Wang; Moo-Chin Wang; Min-Hsiung Hon

No coin nor oath required. For personal study only.

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