𝔖 Bobbio Scriptorium

✦ LIBER ✦

Solder paste for fine line printing in hybrid microelectronics

✍ Scribed by Dubravka Ročak; Vinko Stopar; Janeta Fajfar Plut

Publisher: Elsevier Science
Year: 1995
Tongue: English
Weight: 391 KB
Volume: 26
Category: Article
ISSN: 0026-2692
DOI: 10.1016/0026-2692(95)98946-o

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Stencil printing of solder paste for fin

Stencil printing of solder paste for fine-pitch surface mount assembly : John R. Morris and Thaddeus Wojcik. IEEE Trans. Compon. Hybrids mfg Technol. 14(3), 560 (1991)

📂 Article 📅 1992 🏛 Elsevier Science 🌐 English ⚖ 112 KB

Quality solder paste systems for use in

Quality solder paste systems for use in microelectronic applications : Ronald P. Anjard, Sr.Solid St. Technol. 183 (October 1983)

📂 Article 📅 1984 🏛 Elsevier Science 🌐 English ⚖ 118 KB

Fine-line printing revisited: a look at

Fine-line printing revisited: a look at new dimensions in screens and masks : L. H. Coronis. Proceedings ISHM Microelectronics Symposium, October–November (1972), p. 1-A-1-1

📂 Article 📅 1973 🏛 Elsevier Science 🌐 English ⚖ 110 KB

New thick-film copper paste for ultra-fi

New thick-film copper paste for ultra-fine line circuits : Toshio Ogawa Tadamichi Asai, Osamu Itoh, Mitorhu Hasegawa, Akira Ikegami, Kazuhiko Atoh and Takao Kobayashi. IEEE Trans. Compon Hybrids mfg Technol.12(3), 397 (1989)

📂 Article 📅 1990 🏛 Elsevier Science 🌐 English ⚖ 127 KB