Stencil printing of solder paste for fine-pitch surface mount assembly : John R. Morris and Thaddeus Wojcik. IEEE Trans. Compon. Hybrids mfg Technol. 14(3), 560 (1991)

• Publisher: Elsevier Science
• Year: 1992
• Tongue: English
• Weight: 112 KB
• Volume: 32
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(92)90728-4