✦ LIBER ✦
New thick-film copper paste for ultra-fine line circuits : Toshio Ogawa Tadamichi Asai, Osamu Itoh, Mitorhu Hasegawa, Akira Ikegami, Kazuhiko Atoh and Takao Kobayashi. IEEE Trans. Compon Hybrids mfg Technol.12(3), 397 (1989)
- Publisher
- Elsevier Science
- Year
- 1990
- Tongue
- English
- Weight
- 127 KB
- Volume
- 30
- Category
- Article
- ISSN
- 0026-2714
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