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Simulations of stress evolution and the current density scaling of electromigration-induced failure times in pure and alloyed interconnects

✍ Scribed by Park, Young-Joon; Andleigh, Vaibhav K.; Thompson, Carl V.

Book ID: 120199290
Publisher: American Institute of Physics
Year: 1999
Tongue: English
Weight: 527 KB
Volume: 85
Category: Article
ISSN: 0021-8979
DOI: 10.1063/1.369714

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