✦ LIBER ✦
Nano- and micrometer-scale thin-film-interconnection failure theory and simulation and metallization lifetime prediction, Part 1: A general theory of vacancy transport, mechanical-stress generation, and void nucleation under electromigration in relation to multilevel-metallization degeneration and failure
✍ Scribed by K. A. Valiev; R. V. Goldstein; Yu. V. Zhitnikov; T. M. Makhviladze; M. E. Sarychev
- Book ID
- 110214417
- Publisher
- Springer
- Year
- 2009
- Tongue
- English
- Weight
- 376 KB
- Volume
- 38
- Category
- Article
- ISSN
- 1063-7397
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