Silver-free solders for the soldering of copper and its alloys
โ Scribed by K. V. Vasil'ev; L. O. Kokhlikyan; T. G. Rodina
- Publisher
- Springer
- Year
- 1993
- Tongue
- English
- Weight
- 547 KB
- Volume
- 29
- Category
- Article
- ISSN
- 0009-2355
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In this study, the processing performance of a lead-free Sn-Ag-Cu-Bi solder after rapid laser-beam reflowing was investigated, and the creep behaviors of the soldered joints were evaluated under different homologue temperatures from 0.68 to 0.82, with a systematical comparison to that of a Sn60Pb40
Erosion of the die material during die filling has long been regarded as a possible damage mechanism of dies in high pressure ลฝ . die casting HPDC of aluminium alloys. Melt impingement and erosion have also been proposed to be an important step leading to die soldering. However, there is little info