Semiconductor processing and manufacturing

✍ Scribed by William N. Shafarman; Bulent M. Basol; Jeff S. Britt; Robert B. Hall; Richard E. Rocheleau

• Publisher: John Wiley and Sons
• Year: 1997
• Tongue: English
• Weight: 155 KB
• Volume: 5
• Category: Article
• ISSN: 1062-7995
• DOI: 10.1002/(sici)1099-159x(199709/10)5:5<359::aid-pip186>3.0.co;2-a

✦ Synopsis

The viability of semiconductor deposition and treatment processes for manufacturing are assessed and critical issues identi®ed for CdTe, Cu(InGa)Se 2 , thin ®lm silicon and amorphous silicon technologies. The focus is on increasing throughput and decreasing costs. Speci®c issues include deposition rate, materials utilization, adhesion, uniformity, equipment and process scale-up, compatibility with subsequent processing, module performance and environmental concerns.