The Open University, Milton Keynes, U.K., 1990. - 395 p.<div class="bb-sep"></div>This book it is written for engineers - people who make things ('products') and is about what materials are for. Reorganizes materials science in a new and original way - properties are for service and for production a
Semiconductor Lithography: Principles, Practices, and Materials
โ Scribed by Wayne M. Moreau (auth.)
- Publisher
- Springer US
- Year
- 1988
- Tongue
- English
- Leaves
- 936
- Series
- Microdevices
- Edition
- 1
- Category
- Library
No coin nor oath required. For personal study only.
โฆ Synopsis
Semiconductor lithography is one of the key steps in the manufacturing of integrated silicon-based circuits. In fabricating a semiconductor device such as a transistor, a series of hot processes consisting of vacuum film deposition, oxidations, and dopant implantation are all patterned into microscopic circuits by the wet processes of lithography. Lithography, as adopted by the semiconductor industry, is the process of drawing or printing the pattern of an integrated circuit in a resist material. The pattern is formed and overlayed to a previous circuit layer as many as 30 times in the manufacture of logic and memory devices. With the resist pattern acting as a mask, a permanent device structure is formed by subtractive (removal) etching or by additive deposition of metals or insulators. Each process step in lithography uses inorganic or organic materials to physically transform semiconductors of silicon, insulators of oxides, nitrides, and organic polymers, and metals, into useful electronic devices. All forms of electromagnetic radiation are used in the processing. Lithography is a mUltidisciplinary science of materials, processes, and equipment, interacting to produce three-dimensional structures. Many aspects of chemistry, electrical engineering, materials science, and physics are involved. The purpose of this book is to bring together the work of many scientists and engineers over the last 10 years and focus upon the basic resist materials, the lithographic processes, and the fundamental principles behind each lithographic process.
โฆ Table of Contents
Front Matter....Pages i-xx
Introduction....Pages 1-27
Positive Photoresists....Pages 29-79
Positive Radiation Resists....Pages 81-155
Negative Photoresists....Pages 157-210
Negative Radiation Resists....Pages 211-257
Surface Preparation and Coating....Pages 259-327
Prebake (Softbake)....Pages 329-353
Optical Exposure....Pages 355-408
Radiation Exposure....Pages 409-458
Developing Resist Images....Pages 459-544
Postbake....Pages 545-566
Additive Processes....Pages 567-630
Subtractive Etching....Pages 631-777
Stripping of Resists....Pages 779-812
Process Controls....Pages 813-855
Nonresist Processes....Pages 857-895
Summary and Future Processes....Pages 897-919
Back Matter....Pages 921-931
โฆ Subjects
Electrical Engineering;Optical and Electronic Materials
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