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Scaling analysis of multilevel interconnect temperatures for high-performance ICs

โœ Scribed by Sungjun Im; Srivastava, N.; Banerjee, K.; Goodson, K.E.

Book ID
114618022
Publisher
IEEE
Year
2005
Tongue
English
Weight
759 KB
Volume
52
Category
Article
ISSN
0018-9383

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