Effects of Deposition Temperature on Low-Dielectric Fluorinated Amorphous Carbon Films for Ultralarge-Scale Integration Multilevel Interconnects

✍ Scribed by Sung-Hoon Yang; Jeongwon Park; Jung-Yeul Kim; You-Kee Lee; Bum-Rae Cho; Dong-Koo Park; Won-Hee Lee; Jong-Wan Park

• Publisher: Elsevier Science
• Year: 1999
• Tongue: English
• Weight: 138 KB
• Volume: 63
• Category: Article
• ISSN: 0026-265X
• DOI: 10.1006/mchj.1999.1778