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Room-temperature indentation creep of lead-free Sn-5%Sb solder alloy

✍ Scribed by A. R. Geranmayeh; R. Mahmudi

Book ID: 107453379
Publisher: Springer US
Year: 2005
Tongue: English
Weight: 274 KB
Volume: 34
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-005-0087-4

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## Abstract The influence of cooling rate on the creep behavior of cast Sn–(1–5)%Bi solder alloys was studied by indentation testing at room temperature. The alloys were prepared at two different cooling rates of 0.01 Ks^–1^ and 8 Ks^–1^. This affected the microstructure and thus, the creep behavio