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Effect of Homogenization on the Indentation Creep of Cast Lead-Free Sn-5%Sb Solder Alloy

✍ Scribed by R. Mahmudi; A. R. Geranmayeh; M. Allami; M. Bakherad

Book ID: 107455012
Publisher: Springer US
Year: 2007
Tongue: English
Weight: 478 KB
Volume: 36
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-007-0275-5

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