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Role of Activation Energy of Slow Crack Growth in the High-Temperature Thermal Fatigue of Silicon Nitride

✍ Scribed by D. P. H. HASSELMAN; E. P. CHEN


Book ID
110814476
Publisher
John Wiley and Sons
Year
1977
Tongue
English
Weight
230 KB
Volume
60
Category
Article
ISSN
0002-7820

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