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Resistance of through-thickness grain boundaries to cleavage cracking in silicon thin films

✍ Scribed by Yu Qiao; Jin Chen

Book ID: 113897299
Publisher: Elsevier Science
Year: 2008
Tongue: English
Weight: 312 KB
Volume: 59
Category: Article
ISSN: 1359-6462
DOI: 10.1016/j.scriptamat.2008.03.022

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