Residual stress and thermal expansion coefficient of plasma polymerized films

✍ Scribed by Akira Morinaka; Yoshihiro Asano

• Publisher: John Wiley and Sons
• Year: 1982
• Tongue: English
• Weight: 554 KB
• Volume: 27
• Category: Article
• ISSN: 0021-8995
• DOI: 10.1002/app.1982.070270625

✦ Synopsis

The residual stress in plasma polymerized films and its annealing effect were measured by employing the Newton ring method. The plasma polymerized films studied were hexamethyldisiloxane (HMDS), norbornadiene (NBD), and acryronitrile (AN) films. The stress in the film is compressive, and this compressive stress changes into tensile stress by annealing treatment. The ESR measurement indicates that the annealing effect on the stress is due to the trapped radical reaction. From the thermal stress measurement, the thermal expansion coefficient and Young's modulus have also been obtained; Young's modulus is in the order of magnitude of lo8 g/cmz with HMDS and NBD films, and the thermal expansion coefficient is in the order of magnitude of deg-l with HMDS and NBD films. These values are much different from those of conventional polymer. This is attributed to the highly crosslinked structure of the films.