✦ LIBER ✦

Reliability of submicron InGaAs/InP DHBT under thermal and electrical stresses

✍ Scribed by G.A. Koné; B. Grandchamp; C. Hainaut; F. Marc; C. Maneux; N. Labat; T. Zimmer; V. Nodjiadjim; M. Riet; J. Godin

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Evaluation of encapsulation and passivat

✍ R. F. Kopf; R. A. Hamm; R. W. Ryan; J. Burm; A. Tate; Y. -K. Chen; G. Georgiou; 📂 Article 📅 1998 🏛 Springer US 🌐 English ⚖ 806 KB

Investigation of the degradation mechani

✍ S. Ghosh; B. Grandchamp; G.A. Koné; F. Marc; C. Maneux; T. Zimmer; V. Nodjiadjim 📂 Article 📅 2011 🏛 Elsevier Science 🌐 English ⚖ 678 KB

Slow transients in polyimide-passivated

✍ Chai-Wah Ng; Hong Wang 📂 Article 📅 2004 🏛 IEEE 🌐 English ⚖ 187 KB

Study of samples of composite insulating

✍ Danikas, M.G. 📂 Article 📅 1990 🏛 IEEE 🌐 English ⚖ 715 KB

Lifetimes of polypropylene films under c

✍ Cygan, P.; Krishnakumar, B.; Laghari, J.R. 📂 Article 📅 1989 🏛 IEEE 🌐 English ⚖ 475 KB

Estimation for a life model of transform

✍ Pandey, S.B.; Lin, C. 📂 Article 📅 1992 🏛 IEEE 🌐 English ⚖ 256 KB