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Evaluation of encapsulation and passivation of InGaAs/InP DHBT devices for long-term reliability

✍ Scribed by R. F. Kopf; R. A. Hamm; R. W. Ryan; J. Burm; A. Tate; Y. -K. Chen; G. Georgiou; D. V. Lang; F. Ren

Book ID: 107457729
Publisher: Springer US
Year: 1998
Tongue: English
Weight: 806 KB
Volume: 27
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-998-0127-y

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