✦ LIBER ✦

Reflow and burn-in of a Sn-20In-0.8Cu ball grid array package with a Au/Ni/Cu pad

✍ Scribed by M. J. Chiang; S. Y. Chang; T. H. Chuang

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Intermetallic reactions in Sn-8Zn-20In s

✍ Yu-Chih Liu; Wei-Hong Lin; Hsiu-Jen Lin; Tung-Han Chuang 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 516 KB

Intermetallic reactions in a Sn-20In-2.8

✍ Hui-Min Wu; Feng-Chih Wu; Tung-Han Chuang 📂 Article 📅 2005 🏛 Springer US 🌐 English ⚖ 732 KB

Intermetallic reactions in reflowed and

✍ Hsiu-Jen Lin; Tung-Han Chuang 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 865 KB

Interfacial reactions of Sn–Cu solder wi

✍ M.N. Islam; Y.C. Chan 📂 Article 📅 2005 🏛 Elsevier Science 🌐 English ⚖ 503 KB

Intermetallic compounds formed during th

✍ M. D. Cheng; S. Y. Chang; S. F. Yen; T. H. Chuang 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 42 KB

Intermetallic compounds formed during th

✍ M. D. Cheng; S. Y. Chang; S. F. Yen; T. H. Chuang 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 810 KB