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Reaction of Liquid Sn-Ag-Cu-Ce Solders with Solid Copper

✍ Scribed by J. Chriaštel’ová; L. Rízeková Trnková; K. Pocisková Dimová; M. Ožvold

Book ID: 107457350
Publisher: Springer US
Year: 2011
Tongue: English
Weight: 768 KB
Volume: 40
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-011-1700-3

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