𝔖 Bobbio Scriptorium
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Quality assurance system and reliability testing of LSI circuits

✍ Scribed by F.M. Wurnik


Publisher
Elsevier Science
Year
1983
Tongue
English
Weight
518 KB
Volume
23
Category
Article
ISSN
0026-2714

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Quality assurance system and reliability
πŸ“‚ Article πŸ“… 1986 πŸ› Elsevier Science 🌐 English βš– 95 KB

The microelectronic ball-bond shear test has benn used to study the effects of contamination on bondability, to characterise the reliability of gold-aluminium intermetallic formation, to control bonding machine parameters for device production, and to trouble-shoot such production problems as poor m