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The microelectronic ball-bond shear test has benn used to study the effects of contamination on bondability, to characterise the reliability of gold-aluminium intermetallic formation, to control bonding machine parameters for device production, and to trouble-shoot such production problems as poor metallization adherence and contamination. This paper critically reviews all of these users and identifies ways that the shear test can be implemented to improve bond yield and assure long term bond reliability. A simple, easy made manual shear probe is described that can be used to quickly set up a bonding machine. Data obtained from shearing both aluminium-ball and -wedge bonds are presented and how the shear testing machine requirements for these may differ from those required to test gold ball-bonds are determined. The shear strengths of both annealed gold and aluminium were measured and compiled in a plot of shear force vs. diameter of the bonded area in order to determine the maximum force obtainable when shearing both gold and aluminium bonds having differing ball sizes. Interferences that may produce erroneous shear test results are described along with ways of avoiding such problems. This paper is intended to present all information necessary to both understand and implement the shear test for research purposes or for production control.
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