๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Properties of polyimide films cured on copper

โœ Scribed by Osamu Miura; Hiroshi Watanabe; Kunio Miyazaki; Shunichi Numata


Book ID
112078341
Publisher
John Wiley and Sons
Year
1989
Tongue
English
Weight
435 KB
Volume
72
Category
Article
ISSN
8756-663X

No coin nor oath required. For personal study only.


๐Ÿ“œ SIMILAR VOLUMES


Stress behaviors and thermal properties
โœ Hyunsoo Chung; Jonghwae Lee; Wonbong Jang; Yonggun Shul; Haksoo Han ๐Ÿ“‚ Article ๐Ÿ“… 2000 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 233 KB ๐Ÿ‘ 2 views

The effect of high boiling point solvent on the residual stress behaviors of semiflexible structure poly(4,4ะˆ-oxydiphenylene pyromellitimide) (PMDA-ODA) and pseudo-rodlike poly(p-phenylene biphenyltetracarboximide) (BPDA-PDA) polyimide was investigated. As a solvent, a mixed solution of 20 wt % cycl