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Process latitude enhancement for 3D structure formation in e-beam lithography

โœ Scribed by V.A. Kudryashov; V.V. Krasnov; P.D. Prewett; T.J. Hall


Publisher
Elsevier Science
Year
1997
Tongue
English
Weight
295 KB
Volume
35
Category
Article
ISSN
0167-9317

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โœฆ Synopsis


Investigation of the positive resist dissolution process under low-energy e-bemn exposure has given rise to a new technology of 3D structure fonnation. This technology has a higher process latitude, which is of great hnportance for commercial prt~uction, and is cheap and e,xsy. Multilayer technologies enhance process latitude both for 30 keV and for low energy exposures.


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โœ V.A. Kudryashov; P.D. Prewett; A.G. Michette ๐Ÿ“‚ Article ๐Ÿ“… 2000 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 704 KB

SEM linewidth measurement in the process latitude investigation procedure can be replaced with a resist reflow technique for PMMA and other positive resists. The linewidth dependence on technical parameters can be measured quickly and cheaply with specialised test structures.