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Preparation and Electrical Properties of Boron and Boron Phosphide Films Obtained by Gas Source Molecular Beam Deposition

✍ Scribed by Y. Kumashiro; T. Yokoyama; T. Sakamoto; T. Fujita


Publisher
Elsevier Science
Year
1997
Tongue
English
Weight
226 KB
Volume
133
Category
Article
ISSN
0022-4596

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✦ Synopsis


Boron and boron phosphide films were prepared by gas source molecular beam deposition on sapphire crystal at various substrate temperatures up to 800Β°C using cracked B 2 H 6 (2% in H 2 ) at 300Β°C and cracked PH 3 (20% in H 2 ) at 900Β°C. The substrate temperatures and gas flow rates of the reactant gases determined the film growth. The boron films with amorphous structure are p type. Increasing growth times lead to increasing mobilities and decreasing carrier concentrations. Boron phosphide film with maximum P/B ratio is obtained at a substrate temperature of 600Β°C, below and above which they become phosphorus deficient due to insufficient supply of phosphorus and thermal desorption of the phosphorus as P 2 , respectively, but they are all n type conductors due to phosphorus vacancies.


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