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Preparation and characterization of three-dimensional micro-electrode for micro-supercapacitor based on inductively coupled plasma reactive etching technology

✍ Scribed by ChunMing Wen, ZhiYu Wen, Zheng You, XiaoFeng Wang


Book ID
113083116
Publisher
SP Science China Press
Year
2012
Tongue
English
Weight
884 KB
Volume
55
Category
Article
ISSN
1006-9321

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Advanced etching of silicon based on dee
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Different processes involving an inductively coupled plasma reactor are presented either for deep reactive ion etching or for isotropic etching of silicon. On one hand, high aspect ratio microstructures with aspect ratio up to 107 were obtained on sub-micron trenches. Application to photonic MEMS is