𝔖 Bobbio Scriptorium

✦ LIBER ✦

Precision flip-chip solder bump interconnects for optical packaging : William R. Imler, et al. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(6), 977 (1992)

Publisher: Elsevier Science
Year: 1994
Tongue: English
Weight: 217 KB
Volume: 34
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(94)90248-8

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Direct chip interconnect with adhesive c

Direct chip interconnect with adhesive conductor films : Nagesh R. Basavanhally et al. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(6), 972 (1992)

📂 Article 📅 1994 🏛 Elsevier Science 🌐 English ⚖ 113 KB

Short-pulse propagation technique for ch

Short-pulse propagation technique for characterizing resistive package interconnections : Alina Deutsch, et al. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(6), 1034 (1992)

📂 Article 📅 1994 🏛 Elsevier Science 🌐 English ⚖ 101 KB

An innovative bonding technique for opti

An innovative bonding technique for optical chips using solder bumps that eliminate chip positioning adjustments : Tsuyoshi Hayashi. IEEE Transactions on Components, Hybrids, and Manufacturing Technology15(2), 225 (1992)

📂 Article 📅 1993 🏛 Elsevier Science 🌐 English ⚖ 116 KB

Design of precision capacitors for analo

Design of precision capacitors for analog applications : Stephen A. St. Onge et al. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(6), 1064 (1992)

📂 Article 📅 1994 🏛 Elsevier Science 🌐 English ⚖ 105 KB

The single chip versus multichip packagi

The single chip versus multichip packaging option for digital CMOS in the 1990s : Constantine A. Neugebauer et al. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(5), 915 (1992)

📂 Article 📅 1993 🏛 Elsevier Science 🌐 English ⚖ 111 KB

The simulation of high-speed, high-densi

The simulation of high-speed, high-density digital interconnects in single chip packages and multichip modules : Guang-Wen Pan et al. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(4), 465 (1992)

📂 Article 📅 1993 🏛 Elsevier Science 🌐 English ⚖ 112 KB