✦ LIBER ✦
An innovative bonding technique for optical chips using solder bumps that eliminate chip positioning adjustments : Tsuyoshi Hayashi. IEEE Transactions on Components, Hybrids, and Manufacturing Technology15(2), 225 (1992)
- Publisher
- Elsevier Science
- Year
- 1993
- Tongue
- English
- Weight
- 116 KB
- Volume
- 33
- Category
- Article
- ISSN
- 0026-2714
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