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Poly(silamine)s as new electron-beam resist materials

✍ Scribed by Yukio Nagasaki; Noriyuki Yamazaki; Ken-Ichiro Deguchi; Masao Kato

Publisher
John Wiley and Sons
Year
1996
Tongue
English
Weight
363 KB
Volume
17
Category
Article
ISSN
1022-1336

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✦ Synopsis

Abstract

Several types of poly(silamine)s were prepared and their structure‐characteristics relationships were investigated. When a phenyl ring in the organosilyl unit and/or a cyclic structure in the amino unit was introduced, the glass transition temperatures were increased significantly in order to increase film formability. From the thermogravimetric analysis of the poly(silamine)s, it was found that the thermal decomposition of poly(silamine)s starts at ca. 380–400Β°C. On electron‐beam irradiation of the poly(silamine) films, degradation of the polymer took place. On the basis of these results, poly(silamine)s can be one of the candidates for new positive‐type polymeric resists.

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