✦ LIBER ✦

Packaging of microfluidic chips via interstitial bonding technique

✍ Scribed by Chunmeng Lu; L. James Lee; Yi-Je Juang

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Hands on: thermal bonding of nano- and m

✍ Renberg, Björn ;Sato, Kae ;Tsukahara, Takehiko ;Mawatari, Kazuma ;Kitamori, Take 📂 Article 📅 2009 🏛 Springer-Verlag ⚖ 267 KB

The effect of injection molding PMMA mic

✍ Liqun DU, Hongling Chang, Mancang Song, Chong Liu 📂 Article 📅 2012 🏛 Springer-Verlag 🌐 English ⚖ 774 KB

Adhesive-based bonding technique for PDM

✍ Thompson, C. Shea; Abate, Adam R. 📂 Article 📅 2013 🏛 Royal Society of Chemistry 🌐 English ⚖ 593 KB

Bonding of glass-based microfluidic chip

✍ Lingxin Chen; Guoan Luo; Kehui Liu; Jiping Ma; Bo Yao; Yongchen Yan; Yiming Wang 📂 Article 📅 2006 🏛 Elsevier Science 🌐 English ⚖ 502 KB

Manufacture of microfluidic glass chips

✍ S. Queste; R. Salut; S. Clatot; J.-Y. Rauch; Chantal G. Khan Malek 📂 Article 📅 2010 🏛 Springer-Verlag 🌐 English ⚖ 535 KB

A spring-driven press device for hot emb

✍ Zhi Chen; Luyan Zhang; Gang Chen 📂 Article 📅 2010 🏛 John Wiley and Sons 🌐 English ⚖ 383 KB