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Hands on: thermal bonding of nano- and microfluidic chips

✍ Scribed by Renberg, Björn ;Sato, Kae ;Tsukahara, Takehiko ;Mawatari, Kazuma ;Kitamori, Takehiko


Book ID
106197290
Publisher
Springer-Verlag
Year
2009
Weight
267 KB
Volume
166
Category
Article
ISSN
0344-838X

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