✦ LIBER ✦
Hot embossing and thermal bonding of poly(methyl methacrylate) microfluidic chips using positive temperature coefficient ceramic heater
✍ Scribed by Xia Wang; Luyan Zhang; Gang Chen
- Book ID
- 105895725
- Publisher
- Springer
- Year
- 2011
- Tongue
- English
- Weight
- 993 KB
- Volume
- 401
- Category
- Article
- ISSN
- 1618-2650
No coin nor oath required. For personal study only.