𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Package for development of embedded systems

Publisher
Elsevier Science
Year
1989
Tongue
English
Weight
101 KB
Volume
31
Category
Article
ISSN
0950-5849

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πŸ“œ SIMILAR VOLUMES

De-embedding PCB fixtures for package ch
De-embedding PCB fixtures for package characterization
✍ Scott A. Wartenberg; Phillip Grajek πŸ“‚ Article πŸ“… 2001 πŸ› John Wiley and Sons 🌐 English βš– 98 KB

## Abstract Device characterization hinges on precise measurements of the device under test (DUT). When it cannot be probed directly, mount the package to a PCB fixture. While this makes measurement easy, separating the effects of the DUT from the PCB carrier can be difficult. This paper illustrate

Development of modified embedded atom po
Development of modified embedded atom potentials for the Cu–Ag system
✍ H. Feraoun; H. Aourag; T. Grosdidier; D. Klein; C. Coddet πŸ“‚ Article πŸ“… 2001 πŸ› Elsevier Science 🌐 English βš– 140 KB

The modified embedded atom method is tested in the atomistic simulations of binary fcc metallic alloys. As an example the alloying behaviour of Cu-Ag is studied using the molecular dynamics (MD) method. The MD algorithms that we use are based on the extended Hamiltonian formalism and the ordinary ex

Packaging development for everyday commo
Packaging development for everyday commodities
✍ Cathrine LΓΆfgren; Beatrice Johansson; Ann Lorentzon Karlsson πŸ“‚ Article πŸ“… 2000 πŸ› John Wiley and Sons 🌐 English βš– 765 KB
Comments on β€œde-embedding PCB fixtures f
Comments on β€œde-embedding PCB fixtures for package characterization”
✍ Kimmo Silvonen πŸ“‚ Article πŸ“… 2002 πŸ› John Wiley and Sons 🌐 English βš– 60 KB

## Abstract Β© 2002 Wiley Periodicals, Inc. Microwave Opt Technol Lett 34: 322, 2002; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.10681