De-embedding PCB fixtures for package characterization

✍ Scribed by Scott A. Wartenberg; Phillip Grajek

• Publisher: John Wiley and Sons
• Year: 2001
• Tongue: English
• Weight: 98 KB
• Volume: 31
• Category: Article
• ISSN: 0895-2477
• DOI: 10.1002/mop.1372

✦ Synopsis

Abstract

Device characterization hinges on precise measurements of the device under test (DUT). When it cannot be probed directly, mount the package to a PCB fixture. While this makes measurement easy, separating the effects of the DUT from the PCB carrier can be difficult. This paper illustrates a method of de‐embedding the package S‐parameters from those of the PCB. © 2001 John Wiley & Sons, Inc. Microwave Opt Technol Lett 31: 111–112, 2001.