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Oxygen annealing for deuterium-doped indium tin oxide thin films

โœ Scribed by Okada, Koichi ;Kohiki, Shigemi ;Luo, Suning ;Kohno, Atsushi ;Tajiri, Takayuki ;Ishii, Satoshi ;Sekiba, Daiichiro ;Mitome, Masanori ;Shoji, Fumiya


Publisher
John Wiley and Sons
Year
2011
Tongue
English
Weight
550 KB
Volume
208
Category
Article
ISSN
0031-8965

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โœฆ Synopsis


Abstract

Deuteriumโ€doped indium tin oxide films, fabricated by dc plasma deposition in sputter gas consisting of deuterium and argon, were annealed at 300โ€‰ยฐC for 40โ€‰min in flowing oxygen gas by using tubular gold image furnace. On oxygen annealing, the optical transparency of the film deposited at the gas pressure ratio of deuterium to argon of 3.6% increased from โ‰ˆ30 to 60% at the wavelength of 600โ€‰nm, although that of the films deposited at the ratios of 1 and 1.5% slightly decreased from 88 to 80% and from 85 to 77%, respectively. The resistivity of the films at room temperature, ranged from 2โ€‰ร—โ€‰10^โˆ’4^ to 1.4โ€‰ร—โ€‰10^โˆ’3^โ€‰ฮฉโ€‰cm corresponding to the gas pressure ratio from 1 to 3.6%, was almost the same before and after the annealing for each film. A change in morphology toward a smoother surface by the oxygen annealing was apparent especially for the film with the gas pressure ratio of 3.6%. Agglomeration of randomly oriented grains with diameters of <100โ€“200โ€‰nm observed before the annealing disappeared on annealing. A smoother surface is responsible for higher transparency of the annealed films that contained densely populated hydroxyl bond before the annealing. magnified image

Oxygen annealing at 300โ€‰ยฐC enlarged the optical transmittance (left panel) but decreased the population of hydrogenโ€bonded oxygen (right panel) of the indium tin oxide thin film fabricated by dc plasma deposition in sputter gas containing deuterium of 3.6%.


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