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Overlay high-density interconnect: a chips-first multichip module technology

✍ Scribed by Daum, W.; Burdick, W.E., Jr.; Fillion, R.A.

Book ID: 114545275
Publisher: IEEE
Year: 1993
Tongue: English
Weight: 732 KB
Volume: 26
Category: Article
ISSN: 0018-9162
DOI: 10.1109/2.206510

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