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Optical microscopy imaging method for detection of electromigration: Theory and experiment

✍ Scribed by Li, L. H. ;Dasika, V. ;Heskett, D. ;Tang, W. H.


Publisher
John Wiley and Sons
Year
2007
Tongue
English
Weight
490 KB
Volume
204
Category
Article
ISSN
0031-8965

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✦ Synopsis


Abstract

Electromigration is a microscopic phenomenon involving electric field‐induced diffusion, which is very relevant to damage in interconnects. A common method to monitor interconnect degradation is through electrical resistance measurements, which requires direct electrical contacts. It is desirable to develop non‐contact methods to monitor electromigration damage formation. Recently, we have proposed a novel Optical Microscopy Imaging Method (OMIM). Here we provide theoretical proof and additional experimental results. OMIM provides a new method for studying electromigration‐induced damage. (Β© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)


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