On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints

✍ Scribed by K.E. Yazzie; H.X. Xie; J.J. Williams; N. Chawla

• Book ID: 113899392
• Publisher: Elsevier Science
• Year: 2012
• Tongue: English
• Weight: 610 KB
• Volume: 66
• Category: Article
• ISSN: 1359-6462
• DOI: 10.1016/j.scriptamat.2012.01.009