Additive Occupancy in the Cu6Sn5-Based Intermetallic Compound Between Sn-3.5Ag Solder and Cu Studied Using a First-Principles Approach

✍ Scribed by Feng Gao; Jianmin Qu; Tadashi Takemoto

• Publisher: Springer US
• Year: 2010
• Tongue: English
• Weight: 355 KB
• Volume: 39
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-010-1093-8