✦ LIBER ✦
Theory for intermetallic phase growth between cu and liquid Sn-Pb solder based on grain boundary diffusion control
✍ Scribed by Matt Schaefer; Raymond A. Fournelle; Jin Liang
- Publisher
- Springer US
- Year
- 1998
- Tongue
- English
- Weight
- 756 KB
- Volume
- 27
- Category
- Article
- ISSN
- 0361-5235
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