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On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections

✍ Scribed by J.W.C. de Vries; M.Y. Jansen; W.D. van Driel

Book ID: 108210630
Publisher: Elsevier Science
Year: 2007
Tongue: English
Weight: 407 KB
Volume: 47
Category: Article
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2006.05.009

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