Creep-fatigue crack growth behavior of P
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K. Fakpan; Y. Otsuka; Y. Mutoh; S. Inoue; K. Nagata; K. Kodani
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Article
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2011
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Elsevier
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English
β 612 KB
Fatigue crack growth tests of lead-contained (Sn-37Pb) and lead-free (Sn-3.0Ag-0.5Cu) solders were conducted under frequencies ranged from 10 to 0.1 Hz and a stress ratio of 0.1 at room temperature and 70ο°C. J-integral range (οJ) and modified J-integral (C οͺ ) were used for discussing about cycle-de