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Creep–Fatigue Crack Growth Behavior of Pb-Containing and Pb-Free Solders at Room and Elevated Temperatures

✍ Scribed by Kittichai Fakpan, Yuichi Otsuka, Yoshiharu Mutoh, Shunsuke Inoue, Kohsoku Nagata, Kazuya Kodani

Book ID
118816372
Publisher
Springer US
Year
2012
Tongue
English
Weight
746 KB
Volume
41
Category
Article
ISSN
0361-5235

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Creep-fatigue crack growth behavior of P
Creep-fatigue crack growth behavior of Pb-contained and Pb-free solders at room and elevated temperatures
✍ K. Fakpan; Y. Otsuka; Y. Mutoh; S. Inoue; K. Nagata; K. Kodani 📂 Article 📅 2011 🏛 Elsevier 🌐 English ⚖ 612 KB

Fatigue crack growth tests of lead-contained (Sn-37Pb) and lead-free (Sn-3.0Ag-0.5Cu) solders were conducted under frequencies ranged from 10 to 0.1 Hz and a stress ratio of 0.1 at room temperature and 70C. J-integral range (J) and modified J-integral (C  ) were used for discussing about cycle-de