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Nonhydrostatic stress effects on failure of passivated metallic thin films due to void surface electromigration

✍ Scribed by M.Rauf Gungor; Dimitrios Maroudas

Book ID: 117219815
Publisher: Elsevier Science
Year: 1999
Tongue: English
Weight: 176 KB
Volume: 432
Category: Article
ISSN: 0039-6028
DOI: 10.1016/s0039-6028(99)00655-x

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