New thick-film copper paste for ultra-fi
✦ LIBER ✦
New thick-film copper paste for ultra-fine-line circuits
✍ Scribed by Ogawa, T.; Asai, T.; Itoh, O.; Hasegawa, M.; Ikegami, A.; Atoh, K.; Kobayashi, T.
- Book ID
- 117872631
- Publisher
- IEEE
- Year
- 1989
- Tongue
- English
- Weight
- 442 KB
- Volume
- 12
- Category
- Article
- ISSN
- 0148-6411
- DOI
- 10.1109/33.35488
No coin nor oath required. For personal study only.
📜 SIMILAR VOLUMES
Preparation of ultra fine copper–nickel
✍
Wu Songping; Jiao Li; Ni Jing; Zeng Zhenou; Liu Song
📂
Article
📅
2007
🏛
Elsevier Science
🌐
English
⚖ 853 KB