Preparation of ultra fine copper–nickel bimetallic powders for conductive thick film

✍ Scribed by Wu Songping; Jiao Li; Ni Jing; Zeng Zhenou; Liu Song

• Book ID: 116574406
• Publisher: Elsevier Science
• Year: 2007
• Tongue: English
• Weight: 853 KB
• Volume: 15
• Category: Article
• ISSN: 0966-9795
• DOI: 10.1016/j.intermet.2007.04.001