New thermosetting resin from bisphenol A-based benzoxazine and bisoxazoline

✍ Scribed by Hajime Kimura; Akihiro Matsumoto; Kiichi Hasegawa; Akinori Fukuda

• Publisher: John Wiley and Sons
• Year: 1999
• Tongue: English
• Weight: 213 KB
• Volume: 72
• Category: Article
• ISSN: 0021-8995
• DOI: 10.1002/(sici)1097-4628(19990620)72:12<1551::aid-app7>3.0.co;2-5

✦ Synopsis

Bisphenol A-based benzoxazine was prepared from bisphenol A, formaline, and aniline. Curing reaction of bisphenol A-based benzoxazine with bisoxazoline and the properties of the cured resin were investigated. Consequently, using triphenylphosphite as a catalyst, for the first time the ring-opening reaction of benzoxazine ring occurred at 170°C, and then the phenolic hydroxyl group generated by the ring-opening reaction of the benzoxazine ring reacted with the oxazoline ring at 200°C. The melt viscosity of the molding compound was kept 0.1-1 Pa ⅐ s at 140°C even after 1.5 h, and increased rapidly at 180°C. It was realized that the molding compound showed good flowability below 140°C, curing reaction proceeded above 180°C rapidly. The cured resin from bisphenol A-based benzoxazine and bisoxazoline showed good heat resistance, water resistance, electrical insulation, and mechanical properties, compared with the cured resin from bisphenol A-type novolac and bisoxazoline.