Epoxy resin cured by bisphenol A based benzoxazine
β Scribed by Hajime Kimura; Akihiro Matsumoto; Kiichi Hasegawa; Keiko Ohtsuka; Akinori Fukuda
- Publisher
- John Wiley and Sons
- Year
- 1998
- Tongue
- English
- Weight
- 218 KB
- Volume
- 68
- Category
- Article
- ISSN
- 0021-8995
No coin nor oath required. For personal study only.
β¦ Synopsis
Bisphenol A based benzoxazine was prepared from bisphenol A, formaline, and aniline. This benzoxazine was used as a hardener of the epoxy resin. Curing behavior of the epoxy resin and the properties of the cured resin were investigated. Consequently, curing reaction proceeded without a curing accelerator. The molding compound showed good thermal stability under 150ΠC, which corresponded to the temperature in the cylinder of injection molding. Above 150ΠC, the curing reaction proceeded rapidly. The cured epoxy resin showed good heat resistance, water resistance, electrical insulation, and mechanical properties compared with the epoxy resin cured by the bisphenol A type novolac.
π SIMILAR VOLUMES
Bisphenol A-based benzoxazine was prepared from bisphenol A, formaline, and aniline. Curing reaction of bisphenol A-based benzoxazine with bisoxazoline and the properties of the cured resin were investigated. Consequently, using triphenylphosphite as a catalyst, for the first time the ring-opening r
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